JK

Jason M. Kulick

IC Indiana Integrated Circuits: 15 patents #1 of 20Top 5%
UL University Of Notre Dame Du Lac: 4 patents #48 of 437Top 15%
RT Rochester Institute Of Technology: 2 patents #35 of 250Top 15%
MS Mrsi Systems: 2 patents #3 of 8Top 40%
RI Research Triangle Institute: 1 patents #166 of 344Top 50%
NU North Carolina State University: 1 patents #675 of 1,607Top 45%
SI Science Applications International: 1 patents #220 of 431Top 55%
📍 South Bend, IN: #36 of 809 inventorsTop 5%
🗺 Indiana: #1,882 of 33,936 inventorsTop 6%
Overall (All Time): #271,090 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDate
11523511 Assembling and handling edge interconnect packaging system Tian Lu 2022-12-06
11488660 Adiabatic flip-flop and memory cell design Gregory S. Snider, Rene Celis-Cordova, Alexei Orlov, Tian Lu 2022-11-01
11398463 Edge interconnect self-assembly substrate Tian Lu 2022-07-26
11224126 Edge interconnects for use with circuit boards and integrated circuits Tian Lu, Carlos J. Ortega, Robert Joseph Engelhardt, Jr., John P. Timler 2022-01-11
10945335 Assembling and handling edge interconnect packaging system Tian Lu 2021-03-09
10896898 Edge interconnect self-assembly substrate Tian Lu 2021-01-19
10598861 Method and system to passively align and attach fiber array to laser array or optical waveguide array Yi Qian, Stefan Preble, Jeffrey Steidle, Michael L. Fanto, Tian Lu 2020-03-24
10410989 Inter-chip alignment Douglas C. Hall, Gary H. Bernstein, Anthony Hoffman, Scott Howard 2019-09-10
10409004 Method and system to passively align and attach fiber array to laser array or optical waveguide array Yi Qian, Stefan Preble, Jeffrey Steidle, Michael L. Fanto, Tian Lu 2019-09-10
10325875 Edge interconnect packaging of integrated circuits for power systems Douglas Hopkins 2019-06-18
10182498 Substrates with interdigitated hinged edge interconnects Tian Lu 2019-01-15
10056335 Prototyping of electronic circuits with edge interconnects Tian Lu 2018-08-21
10050027 Quilt packaging system with mated metal interconnect nodules and voids Douglas C. Hall, Scott Howard, Anthony Hoffman, Gary H. Bernstein 2018-08-14
9844139 Method of interconnecting microchips Tian Lu 2017-12-12
9806030 Prototyping of electronic circuits with edge interconnects Tian Lu 2017-10-31
9620473 Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment Douglas C. Hall, Scott Howard, Anthony Hoffman, Gary H. Bernstein 2017-04-11
9163995 Techniques for tiling arrays of pixel elements Joseph D LaVeigne, John Lañnon, Scott Goodwin 2015-10-20