Patents per Year
Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6401728 | Method for cleaning interior of etching chamber | W. H. Cheng, Chia-Fu Yeh, C.M. CHI, Cobby Lee | 2002-06-11 | $2,096,000 |
| 6374832 | Waferless seasoning process | Wen-Hua Cheng, Hung-Chen Yu, Chih-Ming Chi | 2002-04-23 | $1,893,000 |
| 6232226 | Method of fabricating barrier layer in integrated circuit | — | 2001-05-15 | $1,393,000 |
| 4961822 | Fully recessed interconnection scheme with titanium-tungsten and selective CVD tungsten | Kuan-Yang Liao, Maw-Rong Chin, Charles S. Rhoades | 1990-10-09 | |
| 4920403 | Selective tungsten interconnection for yield enhancement | Kuan-Yang Liao, Maw-Rong Chin, Charles S. Rhoades | 1990-04-24 | |
| 4847111 | Plasma-nitridated self-aligned tungsten system for VLSI interconnections | Kuan-Yang Liao, Maw-Rong Chin | 1989-07-11 | |
| 4777061 | Blanket tungsten deposition for dielectric | Schyi-yi Wu, J. B. Price, John Mendonca | 1988-10-11 | $6,807,000 |
| 4737474 | Silicide to silicon bonding process | J. B. Price, John Mendonca, Schyi-yi Wu | 1988-04-12 | $4,759,000 |