Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6083802 | Method for forming an inductor | Wen-Ying Wen | 2000-07-04 |
| 6034439 | Method and structure for preventing bonding pads from peeling caused by plug process | Kuo-Shi Teng, Hao-Chieh Yung, Wen-Haw Lu | 2000-03-07 |
| 5739047 | Method of fabricating a voidless IC electrical plug | — | 1998-04-14 |