Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660593 | Method for fabricating oxide layers with different thicknesses | Shing-Sing Chiang, Kuo-Shi Teng, Yi-Shi Chen | 2003-12-09 |
| 6307266 | Metal-line structure having a spacer structure covering the sidewalls thereof | — | 2001-10-23 |
| 6127252 | Metal-line structure in integrated circuit and method of fabricating the same | — | 2000-10-03 |
| 6075280 | Precision breaking of semiconductor wafer into chips by applying an etch process | Gene Jing-Chiang Chang | 2000-06-13 |
| 6034439 | Method and structure for preventing bonding pads from peeling caused by plug process | Kuo-Shi Teng, Shing-Shing Chiang, Wen-Haw Lu | 2000-03-07 |