Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569150 | Semiconductor bonding pad device and method for forming the same | Hsi-Kai Lo | 2023-01-31 |
| 11099235 | Semiconductor device and method for detecting needle mark shifting | Jian-Sheng Chen, Ming-Huan Hsieh | 2021-08-24 |