Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11569150 | Semiconductor bonding pad device and method for forming the same | Hsi-Kai Lo | 2023-01-31 | |
| 11099235 | Semiconductor device and method for detecting needle mark shifting | Jian-Sheng Chen, Ming-Huan Hsieh | 2021-08-24 | $1,622,000 |