Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7687446 | Method of removing residue left after plasma process | Cheng-Ming Weng, Mei-Chi Wang, Jiunn-Hsiung Liao, Wei Yang | 2010-03-30 |
| 7628866 | Method of cleaning wafer after etching process | Cheng-Ming Weng, Chun-Jen Huang | 2009-12-08 |
| 7378343 | Dual damascence process utilizing teos-based silicon oxide cap layer having reduced carbon content | Jei-Ming Chen, Kuo-Chih Lai, Mei-Ling Chen, Cheng-Ming Weng, Chun-Jen Huang +1 more | 2008-05-27 |
| 7214612 | Dual damascene structure and fabrication thereof | Jen-Ren Huang, Cheng-Ming Weng | 2007-05-08 |
| 7192878 | Method for removing post-etch residue from wafer surface | Cheng-Ming Weng, Chun-Jen Huang | 2007-03-20 |