Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300633 | Warpage-reducing semiconductor structure and fabricating method of the same | Da-Jun Lin, Tai-Cheng Hou, Fu-Yu Tsai, Bin-Siang Tsai | 2025-05-13 |
| 12014995 | Warpage-reducing semiconductor structure and fabricating method of the same | Da-Jun Lin, Tai-Cheng Hou, Fu-Yu Tsai, Bin-Siang Tsai | 2024-06-18 |
| 11632889 | Method of forming memory cell | Da-Jun Lin, Bin-Siang Tsai, Ya-Jyuan Hung, Ting-An Chien | 2023-04-18 |
| 11462513 | Chip bonding alignment structure, chip bonding structure and methods for fabricating the same | Fu-Yu Tsai, Da-Jun Lin, Bin-Siang Tsai | 2022-10-04 |
| 11101324 | Memory cell and forming method thereof | Da-Jun Lin, Bin-Siang Tsai, Ya-Jyuan Hung, Ting-An Chien | 2021-08-24 |
| 11094900 | Semiconductor device and method for fabricating the same | Da-Jun Lin, Bin-Siang Tsai | 2021-08-17 |