Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8097476 | Light emitting diode and wafer level package method, wafer level bonding method thereof, and circuit structure for wafer level package | Ming-Sen Hsu, Chin-Fu Ku, Chih-Ming Chen, Deng-Huei Hwang | 2012-01-17 |
| 7061110 | Ohmic contact to semiconductor devices and method of manufacturing the same | Jin-Kuo Ho, Chao-Nien Huang, Chin-Yuan Chen, Chienchia Chiu, Chenn-shiung Cheng +1 more | 2006-06-13 |
| 6693306 | Structure of a light emitting diode and method of making the same | Tzer-Perng Chen, Rong-Yih Hwang, Cheng-Chung Young | 2004-02-17 |
| 6489250 | Method for cutting group III nitride semiconductor light emitting element | Rong-Yih Hwang, Tzer-Perng Chen | 2002-12-03 |
| 6399408 | Process for producing light emitting device | Tzong-Liang Tsai | 2002-06-04 |
| 6380564 | Semiconductor light emitting device | Tzer-Perng Chen, Rong-Yih Hwang | 2002-04-30 |
| 6319808 | Ohmic contact to semiconductor devices and method of manufacturing the same | Jin-Kuo Ho, Chao-Nien Huang, Chin-Yuan Chen, Chienchia Chiu, Chenn-shiung Cheng +1 more | 2001-11-20 |