Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8097476 | Light emitting diode and wafer level package method, wafer level bonding method thereof, and circuit structure for wafer level package | Charng-Shyang Jong, Ming-Sen Hsu, Chih-Ming Chen, Deng-Huei Hwang | 2012-01-17 |
| 6936860 | Light emitting diode having an insulating substrate | Shu-Wen Sung, Chia-Cheng Liu, Min-Hsun Hsieh, Chao-Nien Huang, Chen Ou +1 more | 2005-08-30 |