Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6581486 | Integrated circuit tester having a fail-safe mechanism for moving IC-chips | David John Ditri, James Mason Brafford | 2003-06-24 |
| 6271048 | Process for recycling a substrate from an integrated circuit package | Kenneth Patrick Reilich, Elvira Widyani Preecha, Joel Elwood Wing, Lorraine Lo-Lan Wing | 2001-08-07 |
| 6105851 | Method of casting I/O columns on an electronic component with a high yield | Kenneth Walter Economy | 2000-08-22 |
| 5918516 | Method of forming I/O columns with open ends that are free of crater-like voids | Kenneth Walter Economy | 1999-07-06 |
| 5839191 | Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package | Kenneth Walter Economy, Richard Leigh Bumann | 1998-11-24 |
| 5816481 | Pin block method of dispensing solder flux onto the I/O pads of an integrated circuit package | Kenneth Walter Economy, Richard Leigh Bumann | 1998-10-06 |
| 5724229 | Electromechanical assembly having a lid which protects IC chips and holds contact springs | Jerry Ihor Tustaniwskyi, Leonard Harry Alton, Ronald Jack Kuntz | 1998-03-03 |
| 5572404 | Heat transfer module incorporating liquid metal squeezed from a compliant body | Wilbur T. Layton, James A. Roecker | 1996-11-05 |
| 5561590 | Heat transfer sub-assembly incorporating liquid metal surrounded by a seal ring | Wilbur T. Layton, James A. Roecker | 1996-10-01 |
| 5454159 | Method of manufacturing I/O terminals on I/O pads | — | 1995-10-03 |
| 5303618 | Via hole punch | — | 1994-04-19 |
| 5087396 | Method of forming holes in unfired ceramic layers of integrated circuit packages | Gordon O. Zablotny, Robert D. Curtis, James W. Horner | 1992-02-11 |
| 5075765 | Low stress multichip module | — | 1991-12-24 |
| 4643935 | Epoxy-glass integrated circuit package having bonding pads in a stepped cavity | Norman E. McNeal, Richárd Nagy | 1987-02-17 |
| 4636275 | Elastic bladder method of fabricating an integrated circuit package having bonding pads in a stepped cavity | — | 1987-01-13 |
| 4519760 | Machine for filling via holes in an integrated circuit package with conductive ink | — | 1985-05-28 |