Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4680075 | Thermoplastic plug method of fabricating an integrated circuit package having bonding pads in a stepped cavity | Richárd Nagy | 1987-07-14 |
| 4643935 | Epoxy-glass integrated circuit package having bonding pads in a stepped cavity | Richárd Nagy, Ronald A. Norell | 1987-02-17 |
| 4598308 | Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die | Christopher D. James | 1986-07-01 |