WL

Wen-Lung Lai

UT Unimicron Technology: 2 patents #115 of 284Top 45%
TSMC: 1 patents #8,466 of 12,232Top 70%
Overall (All Time): #1,474,898 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
9916990 Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure Yuan-Liang Lo 2018-03-13
9721883 Integrated circuit and manufacturing method thereof Chen-Chieh Chiang, Chi-Cherng Jeng, Shiu-Ko JangJian 2017-08-01
9230899 Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure Yuan-Liang Lo 2016-01-05