Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11277909 | Three-dimensional circuit assembly with composite bonded encapsulation | Joseph William Heery, Jr. | 2022-03-15 |
| 9532465 | Method of fabricating a printed circuit board interconnect assembly | Joseph William Heery, Jr. | 2016-12-27 |