Issued Patents All Time
Showing 126–150 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453777 | Power electronics assemblies with cio bonding layers and double sided cooling, and vehicles incorporating the same | Ercan Mehmet Dede | 2019-10-22 |
| 10403594 | Hybrid bonding materials comprising ball grid arrays and metal inverse opal bonding layers, and power electronics assemblies incorporating the same | Ercan Mehmet Dede | 2019-09-03 |
| 10385469 | Thermal stress compensation bonding layers and power electronics assemblies incorporating the same | Ercan Mehmet Dede | 2019-08-20 |
| 10388590 | Cooling bond layer and power electronics assemblies incorporating the same | Ercan Mehmet Dede | 2019-08-20 |
| 10381223 | Multilayer composite bonding materials and power electronics assemblies incorporating the same | — | 2019-08-13 |
| 10377407 | Cooling systems for vehicle interior surfaces | Brian J. Pinkelman, Umesh N. Gandhi | 2019-08-13 |
| 10354462 | Fault diagnosis in power electronics using adaptive PCA | Lingyi Zhang, Weiqiang Chen, Krishna Pattipatti, Ali M. Bazzi, Ercan M. Dede | 2019-07-16 |
| 10347601 | Power electronics assemblies with metal inverse opal bonding, electrical contact and cooling layers, and vehicles incorporating the same | Ercan Mehmet Dede | 2019-07-09 |
| 10290911 | Cooling loops and vehicles incorporating the same | Feng Zhou, Ercan Mehmet Dede | 2019-05-14 |
| 10267568 | Programmable ultrasonic thermal diodes | Ercan Mehmet Dede, Feng Zhou | 2019-04-23 |
| 10231364 | Fluidly cooled power electronics assemblies having a thermo-electric generator | Ercan Mehmet Dede, Chi-Ming Wang | 2019-03-12 |
| 10224265 | Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system | Yuji Fukuoka, Ercan Mehmet Dede, Feng Zhou | 2019-03-05 |
| 10206310 | Electronics assemblies incorporating three-dimensional heat flow structures | Hiroshi Ukegawa, Yanghe Liu, Feng Zhou, Ercan Mehmet Dede | 2019-02-12 |
| 10174659 | Switchable radiative energy harvesting systems | Debasish Banerjee, Shashi Honnikoppa | 2019-01-08 |
| 10109556 | Systems and methods for spring-based device attachment | Masao Noguchi | 2018-10-23 |
| 10082047 | Rapid warm-up schemes of engine and engine coolant for higher fuel efficiency | Ercan Mehmet Dede | 2018-09-25 |
| 10083917 | Power electronics assemblies and vehicles incorporating the same | Yanghe Liu, Ercan Mehmet Dede | 2018-09-25 |
| 10043731 | Multi-step processes for high temperature bonding and bonded substrates formed therefrom | Masao Noguchi | 2018-08-07 |
| 10032694 | Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system | Yuji Fukuoka, Ercan Mehmet Dede, Feng Zhou | 2018-07-24 |
| 10020243 | Power electronics assemblies having a wide bandgap semiconductor device and an integrated fluid channel system | Yuji Fukuoka, Ercan Mehmet Dede, Feng Zhou | 2018-07-10 |
| 9974208 | Pool boiling system | Ercan Mehmet Dede | 2018-05-15 |
| 9905532 | Methods and apparatuses for high temperature bonding and bonded substrates having variable porosity distribution formed therefrom | Masao Noguchi | 2018-02-27 |
| 9903664 | Jet impingement cooling apparatuses having non-uniform jet orifice sizes | — | 2018-02-27 |
| 9848508 | Cooling systems and synthetic jets configured to harvest energy and vehicles including the same | Songtao Wu, Debasish Banerjee | 2017-12-19 |
| 9810129 | Integrated waste heat recovery and motor assisted turbocharger system | Feng Zhou, Ercan Mehmet Dede | 2017-11-07 |