Issued Patents All Time
Showing 76–100 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11169899 | Mitigating data offsets for machine learning | Ali M. Bazzi, Lingyi Zhang, Weiqiang Chen, Krishna Pattipati, Donald McMenemy | 2021-11-09 |
| 11153996 | Thermal management assemblies for electronic assemblies mounted on a motor end | Shohei Suenaga | 2021-10-19 |
| 11125248 | Fan performance tuning | Ercan Mehmet Dede, Umesh N. Gandhi | 2021-09-21 |
| 11121061 | Cooling chip structures having a jet impingement system and assembly having the same | Naoya Take | 2021-09-14 |
| 11113168 | Distributed architecture for fault monitoring | Ercan M. Dede, Lingyi Zhang, Weiqiang Chen, Krishna Pattipatti, Ali M. Bazzi | 2021-09-07 |
| 11098960 | Cooling devices including a variable angle contact surface and methods for cooling heat-generating devices with a cooling device | — | 2021-08-24 |
| 11101193 | Power electronics modules including integrated jet cooling | Naoya Take, Ercan Mehmet Dede | 2021-08-24 |
| 11093315 | Systems and methods for detecting a fault or a model mismatch | Donald McMenemy, Weiqiang Chen, Ali M. Bazzi, Krishna Pattipati | 2021-08-17 |
| 11069594 | Methods of forming electronic assemblies with inverse opal structures using variable current density electroplating | Paul V. Braun, Julia Kohanek, Gaurav Singhal | 2021-07-20 |
| 11067343 | Thermal compensation layers with core-shell phase change particles and power electronics assemblies incorporating the same | Ercan Mehmet Dede | 2021-07-20 |
| 11031317 | Direct bonded metal substrates with encapsulated phase change materials and electronic assemblies incorporating the same | Yanghe Liu | 2021-06-08 |
| 11031318 | Encapsulated phase change porous layer | — | 2021-06-08 |
| 11024921 | Component insulation systems | Ercan Mehmet Dede | 2021-06-01 |
| 11004769 | Metal inverse opal substrate with integrated jet cooling in electronic modules | — | 2021-05-11 |
| 10999919 | Flexible electronic assembly for placement on a vehicle motor assembly | — | 2021-05-04 |
| 10964469 | Cooling magnetic cores with ferrofluid and magnetic cores so cooled | Jongwon Shin, Ercan Mehmet Dede, Masanori Ishigaki | 2021-03-30 |
| 10948241 | Vapor chamber heat spreaders having improved transient thermal response and methods of making the same | — | 2021-03-16 |
| 10945333 | Thermal management assemblies having cooling channels within electrically insulated posts for cooling electronic assemblies | Shohei Suenaga, Yanghe Liu | 2021-03-09 |
| 10903186 | Power electronic assemblies with solder layer and exterior coating, and methods of forming the same | Naoya Take | 2021-01-26 |
| 10896865 | Power electronics modules including an integrated cooling channel extending through an electrically-conductive substrate | Naoya Take, Ercan Mehmet Dede, Yanghe Liu | 2021-01-19 |
| 10892206 | Methods of forming power electronic assemblies using metal inverse opal structures and encapsulated-polymer spheres | — | 2021-01-12 |
| 10886251 | Multi-layered composite bonding materials and power electronics assemblies incorporating the same | — | 2021-01-05 |
| 10888036 | Thermal management assemblies for electronic assemblies circumferentially mounted on a motor | Shohei Suenaga | 2021-01-05 |
| 10879209 | Encapsulated stress mitigation layer and power electronic assemblies incorporating the same | Naoya Take | 2020-12-29 |
| 10861816 | Electronic assemblies having a mesh bond material and methods of forming thereof | Naoya Take | 2020-12-08 |