Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8129206 | Light emitting diode package and method of making the same | Hung-Yi Lin, Yen-Ting Kung, She-Fen Tien | 2012-03-06 |
| 7987588 | Interposer for connecting plurality of chips and method for manufacturing the same | Chang Wang, Hsiu-Ming Li, Shih-Min Huang, Hui-Chen Kuo, Chia-Chun Chen | 2011-08-02 |
| 7795131 | Method of fabricating metal interconnects and inter-metal dielectric layer thereof | Jie Huang, Chung-Hsiang Wang | 2010-09-14 |
| 7732233 | Method for making light emitting diode chip package | Hung-Yi Lin, Yen-Ting Kung, She-Fen Tien | 2010-06-08 |
| 7262078 | Method of forming a wear-resistant dielectric layer | Wei-Shun Lai, Shu-Hua Hu, Chin-Chang Pan, Yuan-Chin Hsu | 2007-08-28 |