Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12256573 | Sensor package structure | Chia-Shuai Chang, Chien-Hung Lin, Wei Wang, BAE-YINN HWANG, JYUN-HUEI JIANG | 2025-03-18 |
| 7544621 | Method of removing a metal silicide layer on a gate electrode in a semiconductor manufacturing process and etching method | Cheng-Kuen Chen, Chih-Ning Wu, Wei-Tsun Shiau | 2009-06-09 |