Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12376399 | Sensor package structure | CHIEN-CHEN LEE, Chien-Yuan Wang, Yi-Chih Lee, LI-CHUN HUNG | 2025-07-29 |
| 12256573 | Sensor package structure | Chien-Hung Lin, WEN-FU YU, Wei Wang, BAE-YINN HWANG, JYUN-HUEI JIANG | 2025-03-18 |
| 12189152 | Sensor lens assembly | CHIEN-CHEN LEE, LI-CHUN HUNG | 2025-01-07 |
| 12177996 | Sensor package structure | LI-CHUN HUNG, CHIEN-CHEN LEE | 2024-12-24 |
| 12174446 | Sensor lens assembly having non-soldering configuration | CHIEN-CHEN LEE, LI-CHUN HUNG, Chien-Yuan Wang | 2024-12-24 |
| 12108517 | Sensor lens assembly having non-soldering configuration | CHIEN-CHEN LEE, LI-CHUN HUNG, Ya-Han Chang | 2024-10-01 |
| 11792497 | Sensor lens assembly having non-reflow configuration | CHIEN-CHEN LEE, Jui-Hung Hsu | 2023-10-17 |
| 11764240 | Method of manufacturing image sensing chip package structure including an adhesive loop | — | 2023-09-19 |
| 11744010 | Sensor lens assembly having non-reflow configuration | CHIEN-CHEN LEE, Ya-Han Chang | 2023-08-29 |
| 11723147 | Sensor lens assembly having non-reflow configuration | CHIEN-CHEN LEE, Jui-Hung Hsu | 2023-08-08 |
| 11502020 | Electronic device having a chip package module | — | 2022-11-15 |
| 11411029 | Image sensing chip package structure including adhesive loop | — | 2022-08-09 |
| 10867158 | Process for making a fingerprint sensor package module and the fingerprint sensor package module made thereby | — | 2020-12-15 |
| 9892302 | Fingerprint sensing device and method for producing the same | Zzu-Chi Chiu, Chien-Cheng WEI | 2018-02-13 |
| 7388192 | Image sensing module and process for packaging the same | Chia-Ming Wu | 2008-06-17 |