Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6145422 | Method of positioning work piece and system therefor | Shozo Katamachi | 2000-11-14 |
| 6067976 | Wafer cut method with wire saw apparatus and apparatus thereof | Ichiro Katayama, Shozo Katamachi | 2000-05-30 |
| 5904136 | Wire saw and slicing method thereof | Shinji Nagatsuka, Jiro Tsuchishima | 1999-05-18 |
| 5893308 | Method of positioning work piece and system therefor | Shozo Katamachi | 1999-04-13 |
| 5857454 | Wire saw and method of slicing ingot by wire saw | — | 1999-01-12 |
| 5295331 | Method of chamfering semiconductor wafer | Katsuo Honda, Yoshio Kamoshita, Katsuhiro Tago | 1994-03-22 |