KH

Katsuo Honda

TC Tokyo Seimitsu Co.: 12 patents #5 of 257Top 2%
Overall (All Time): #388,731 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
6913526 Polishing machine for polishing periphery of sheet 2005-07-05
6752701 Planarization apparatus with grinding and etching devices and holding device for moving workpiece between said devices 2004-06-22
6042459 Surface machining method and apparatus 2000-03-28
6030278 Surface machining method and apparatus 2000-02-29
5816895 Surface grinding method and apparatus 1998-10-06
5791976 Surface machining method and apparatus 1998-08-11
5524604 Method and apparatus for slicing semiconductor wafers 1996-06-11
5295331 Method of chamfering semiconductor wafer Yoshio Kamoshita, Shinji Shibaoka, Katsuhiro Tago 1994-03-22
5000156 Method and device for dressing an inner peripheral blade in a slicing machine Masato Inamura 1991-03-19
4903681 Method and apparatus for cutting a cylindrical material Shuichi Tsukada 1990-02-27
4894956 Apparatus and method for slicing a wafer Susumu Sawafuji 1990-01-23
4852304 Apparatus and method for slicing a wafer Susumu Sawafuji 1989-08-01
4838238 Internal peripheral edge type blade holding device Susumu Sawafuji, Tomio Tomita 1989-06-13