Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7601615 | Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus | Tomoo Hayashi | 2009-10-13 |
| 7521384 | Method and apparatus for peeling surface protective film | Masaki Kanazawa, Minoru Ametani, Daisuke Akita | 2009-04-21 |
| 6039638 | Work planarizing method and apparatus | Hitoshi NAGAYAMA | 2000-03-21 |