DA

Daisuke Akita

DI Disco: 2 patents #249 of 708Top 40%
FA Fanuc: 1 patents #1,202 of 1,735Top 70%
TC Tokyo Seimitsu Co.: 1 patents #110 of 257Top 45%
YA Yamatake: 1 patents #76 of 243Top 35%
Overall (All Time): #908,205 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12325104 Grinding method of workpiece Yoshikazu Suzuki, Makoto Saito 2025-06-10
12285835 Hard wafer grinding method Makoto Saito, Takashi Yamaguchi 2025-04-29
10850344 Robot Masaaki Uematsu 2020-12-01
8136412 Electromagnetic flowmeter Tomoshige Yamamoto, Yoshio Yamazaki, Kenji Yao 2012-03-20
7521384 Method and apparatus for peeling surface protective film Masaki Kanazawa, Minoru Ametani, Motoi Nezu 2009-04-21