Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7508495 | Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage | Masayuki Sumita, Masaki Sekino | 2009-03-24 |
| 6936676 | One-part, room temperature moisture curable resin composition | Hiroyuki Okuhira, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani | 2005-08-30 |
| 6756466 | One-part, room temperature moisture curable resin composition | Hiroyuki Okuhira, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani | 2004-06-29 |
| 6525159 | One-pack cold moisture curable resin compositions | Hiroyuki Okuhira, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani | 2003-02-25 |
| 6476160 | One-pack composition of epoxy resin(s) with no oh groups and ketimine | Hiroyuki Okuhira | 2002-11-05 |
| 6329460 | Polysiloxane composition and rubber composition and resin composition | Kazunori Ishikawa, Fumito Yatsuyanagi, Hiroyuki Kaido | 2001-12-11 |
| 6221998 | One-pack type moisture-curable composition | Hiroyuki Okuhira | 2001-04-24 |
| 5292812 | Adhesive of epoxy resin, CTBN and maleimide | Hajime Yamazaki, Hiroyuki Wakamatsu, Toshinobu Takahashi | 1994-03-08 |