Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721828 | Apparatus for manufacturing laminated electrode body | Hideyasu Kamigawa, Takeshi Yamamoto | 2023-08-08 |
| 11476491 | Electrode pressure-bonding device | Hideyasu Kamigawa, Takeshi Yamamoto | 2022-10-18 |
| 11090827 | Cutting device | Takeshi Yamamoto, Hideyasu Kamigawa | 2021-08-17 |
| 10991968 | Conveying device | Hideyasu Kamigawa, Koichiro Fujiwake | 2021-04-27 |
| 7508495 | Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage | Naoya Adachi, Masaki Sekino | 2009-03-24 |