Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5517127 | Additive structure and method for testing semiconductor wire bond dies | Richard J. Bergeron, Thomas Lamothe, John A. Thompson | 1996-05-14 |
| 5055169 | Method of making mixed metal oxide coated substrates | Vincent F. Hock, John H. Givens, James M. Rigsbee | 1991-10-08 |