Richard J. Bergeron

IBM: 1 patents #44,794 of 70,183Top 65%

📍 South Burlington, VT: #758 of 1,136 inventorsTop 70%

🗺 Vermont: #3,027 of 4,968 inventorsTop 65%

Overall (All Time): #3,742,799 of 4,157,543Top 95%

Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
5517127	Additive structure and method for testing semiconductor wire bond dies	Thomas Lamothe, Joseph E. Suarez, John A. Thompson	1996-05-14