Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7199036 | Under-bump metallization layers and electroplated solder bumping technology for flip-chip | Guowei David Xiao | 2007-04-03 |
| 7135355 | Stencil mask design method and under bump metallurgy for C4 solder bump | Guowei David Xiao | 2006-11-14 |