| 12274105 |
Leadframe, bracket and LED device |
Chuiming Wan, Zhaoming ZENG, Yu HOU, Wenmin Zhu, Yian Lan |
2025-04-08 |
| 12176466 |
LED device and bracket thereof |
Chuiming Wan, Zhaoming ZENG, Yian Lan, Linshan Li, Wenmin Zhu |
2024-12-24 |
| 11367811 |
White light emitting diode and backlight module |
Shuguang Yao, Chuiming Wan, Xiaofeng Long, ChiWing Keung, Zhaoming ZENG |
2022-06-21 |
| 11271142 |
Red luminophor, LED device and method for making the LED device |
Chuiming Wan, Zhaoming ZENG, Shuguang Yao, ChiWing Keung, Ru-Shi Liu |
2022-03-08 |
| 9496464 |
Light emitting device and TV back-light module with wide color gamut |
Shuguang Yao, Chuiming Wan, Ruxi Liu, Zhaoming ZENG, Zhirong JIANG +1 more |
2016-11-15 |
| 8138515 |
Surface mounted LED structure and packaging method of integrating functional circuits on a silicon |
Zhaoming ZENG, Haiying Chen, Yugang Zhou, Yu HOU |
2012-03-20 |
| 7199036 |
Under-bump metallization layers and electroplated solder bumping technology for flip-chip |
Chingho Philip Chan |
2007-04-03 |
| 7135355 |
Stencil mask design method and under bump metallurgy for C4 solder bump |
Chingho Philip Chan |
2006-11-14 |