Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9057853 | Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects | Hon Shing Lau, Shi-Wei Lee, Matthew Ming Fai Yuen, Jingshen Wu, Haibo Fan +1 more | 2015-06-16 |
| 8604603 | Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers | Hon Shing Lau, Shi-Wei Lee, Matthew Ming Fai Yuen, Jingshen Wu, Haibo Fan +1 more | 2013-12-10 |