Issued Patents All Time
Showing 26–50 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9660008 | High-yield fabrication of large-format substrates with distributed, independent control elements | Christopher Bower, John W. Hamer, Ronald S. Cok | 2017-05-23 |
| 9601671 | Optical systems fabricated by printing-based assembly | John A. Rogers, Ralph G. Nuzzo, Matthew Meitl, Alfred J. Baca, Michael Motala +6 more | 2017-03-21 |
| 9515025 | Stretchable form of single crystal silicon for high performance electronics on rubber substrates | John A. Rogers, Dahl-Young Khang, Yugang Sun | 2016-12-06 |
| 9496155 | Methods of selectively transferring active components | Joseph Carr | 2016-11-15 |
| 9450043 | Methods and devices for fabricating and assembling printable semiconductor elements | Ralph G. Nuzzo, John A. Rogers, Keon Jae Lee, Dahl-Young Khang, Yugang Sun +2 more | 2016-09-20 |
| 9443883 | Methods of forming printable integrated circuit devices and devices formed thereby | Christopher Bower, Matthew Meitl, Joseph Carr | 2016-09-13 |
| 9412727 | Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion | John A. Rogers, Seok Kim, Andrew Carlson | 2016-08-09 |
| 9355854 | Methods of fabricating printable compound semiconductor devices on release layers | Matthew Meitl, Christopher Bower, James Thomas Carter, Allen Gray, Salvatore Bonafede | 2016-05-31 |
| 9349900 | Release strategies for making transferable semiconductor structures, devices and device components | John A. Rogers, Ralph G. Nuzzo, Matthew Meitl, Heung Cho Ko, Jongseung Yoon +1 more | 2016-05-24 |
| 9324733 | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics | John A. Rogers, Matthew Meitl, Yugang Sun, Heung Cho Ko, Andrew Carlson +7 more | 2016-04-26 |
| 9165989 | High-yield fabrication of large-format substrates with distributed, independent control elements | Christopher Bower, John W. Hamer, Ronald S. Cok | 2015-10-20 |
| 9161448 | Laser assisted transfer welding process | Matthew Meitl, John A. Rogers | 2015-10-13 |
| 9142468 | Structures and methods for testing printable integrated circuits | Christopher Bower, Matthew Meitl | 2015-09-22 |
| 9117940 | Optical systems fabricated by printing-based assembly | John A. Rogers, Ralph G. Nuzzo, Matthew Meitl, Alfred J. Baca, Michael Motala +6 more | 2015-08-25 |
| 9105555 | Stretchable form of single crystal silicon for high performance electronics on rubber substrates | John A. Rogers, Dahl-Young Khang, Yugang Sun | 2015-08-11 |
| 9049797 | Electrically bonded arrays of transfer printed active components | Christopher Bower, Matthew Meitl, Philip E. Garrou | 2015-06-02 |
| 9040425 | Methods of forming printable integrated circuit devices and devices formed thereby | Christopher Bower, Matthew Meitl, Joseph Carr | 2015-05-26 |
| 8894754 | Breathing and desiccant regenerating cycle for reducing condensation in concentrator photovoltaic modules | Scott Burroughs | 2014-11-25 |
| 8895406 | Release strategies for making transferable semiconductor structures, devices and device components | John A. Rogers, Ralph G. Nuzzo, Matthew Meitl, Heung Cho Ko, Jongseung Yoon +1 more | 2014-11-25 |
| 8877648 | Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby | Christopher Bower, Matthew Meitl | 2014-11-04 |
| 8754396 | Stretchable form of single crystal silicon for high performance electronics on rubber substrates | John A. Rogers, Dahl-Young Khang, Yugang Sun | 2014-06-17 |
| 8729524 | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics | John A. Rogers, Matthew Meitl, Yugang Sun, Heung Cho Ko, Andrew Carlson +7 more | 2014-05-20 |
| 8722458 | Optical systems fabricated by printing-based assembly | John A. Rogers, Ralph G. Nuzzo, Matthew Meitl, Alfred J. Baca, Michael Motala +6 more | 2014-05-13 |
| 8664699 | Methods and devices for fabricating and assembling printable semiconductor elements | Ralph G. Nuzzo, John A. Rogers, Keon Jae Lee, Dahl-Young Khang, Yugang Sun +2 more | 2014-03-04 |
| 8506867 | Printing semiconductor elements by shear-assisted elastomeric stamp transfer | — | 2013-08-13 |