Issued Patents All Time
Showing 151–175 of 246 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10516194 | Thermal management solution for battery pack | Feng Zhou | 2019-12-24 |
| 10495387 | Multi-layer wick structures with surface enhancement and fabrication methods | Feng Zhou | 2019-12-03 |
| 10489525 | Systems and methods for composite thermal interface material microstructure property prediction | Shailesh N. Joshi, Masao Noguchi | 2019-11-26 |
| 10481651 | Integrated PCU and GPU cooling system | Jongwon Shin | 2019-11-19 |
| 10479218 | Electric vehicle power system with shared converter | Jae Seung Lee, Jongwon Shin | 2019-11-19 |
| 10453777 | Power electronics assemblies with cio bonding layers and double sided cooling, and vehicles incorporating the same | Shailesh N. Joshi | 2019-10-22 |
| 10423739 | Methods for orienting material physical properties using constraint transformation and isoparametric shape functions | Tsuyoshi Nomura | 2019-09-24 |
| 10424528 | Layered cooling structure including insulative layer and multiple metallization layers | Feng Zhou, Yanghe Liu | 2019-09-24 |
| 10403594 | Hybrid bonding materials comprising ball grid arrays and metal inverse opal bonding layers, and power electronics assemblies incorporating the same | Shailesh N. Joshi | 2019-09-03 |
| 10395940 | Method of etching microelectronic mechanical system features in a silicon wafer | Feng Zhou, Ki Wook Jung, Mehdi Asheghi, Kenneth E. Goodson | 2019-08-27 |
| 10385469 | Thermal stress compensation bonding layers and power electronics assemblies incorporating the same | Shailesh N. Joshi | 2019-08-20 |
| 10388810 | Power electronics assemblies having opticondistors and an embedded active cooling chip | — | 2019-08-20 |
| 10388590 | Cooling bond layer and power electronics assemblies incorporating the same | Shailesh N. Joshi | 2019-08-20 |
| 10381901 | Wireless in-wheel electric assemblies with integrated in-wheel cooling and vehicles incorporating the same | Feng Zhou, Hiroshi Ukegawa, Kyosuke Miyagi | 2019-08-13 |
| 10347601 | Power electronics assemblies with metal inverse opal bonding, electrical contact and cooling layers, and vehicles incorporating the same | Shailesh N. Joshi | 2019-07-09 |
| 10330400 | Self-assembled or reconfigurable structures for heat flow control devices | — | 2019-06-25 |
| 10334756 | Manifold structures having an integrated fluid channel system and assemblies comprising the same | Jongwon Shin, Yanghe Liu, Jae Seung Lee | 2019-06-25 |
| 10290911 | Cooling loops and vehicles incorporating the same | Feng Zhou, Shailesh N. Joshi | 2019-05-14 |
| 10279676 | Hybrid vehicle with in wheel motor and rankine cycle system | Feng Zhou | 2019-05-07 |
| 10267568 | Programmable ultrasonic thermal diodes | Feng Zhou, Shailesh N. Joshi | 2019-04-23 |
| 10252610 | Electric vehicle and fuel cell vehicle with rankine cycle | Feng Zhou | 2019-04-09 |
| 10239402 | Hybrid vehicle with rankine cycle system, in-wheel motor and power module integrated with power train components | Feng Zhou | 2019-03-26 |
| 10231364 | Fluidly cooled power electronics assemblies having a thermo-electric generator | Shailesh N. Joshi, Chi-Ming Wang | 2019-03-12 |
| 10224265 | Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system | Yuji Fukuoka, Shailesh N. Joshi, Feng Zhou | 2019-03-05 |
| 10209016 | Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same | Tsuyoshi Nomura | 2019-02-19 |