RD

Rachita Dewan

University Of Texas System: 1 patents #2,951 of 6,559Top 45%
📍 Washington, DC: #1,663 of 3,063 inventorsTop 55%
🗺 District of Columbia: #1,663 of 3,063 inventorsTop 55%
Overall (All Time): #3,108,633 of 4,157,543Top 75%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8741737 Three-dimensional wafer stacking with vertical interconnects Dan O. Popa, Praveen Pandojirao-Sunkojirao, Jung-Chih Chiao 2014-06-03