Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8741737 | Three-dimensional wafer stacking with vertical interconnects | Dan O. Popa, Rachita Dewan, Jung-Chih Chiao | 2014-06-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8741737 | Three-dimensional wafer stacking with vertical interconnects | Dan O. Popa, Rachita Dewan, Jung-Chih Chiao | 2014-06-03 |