Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748867 | Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices | Ryan Wicker, Eric MacDonald, David Espalin, Danny W. Muse | 2020-08-18 |
| 10660214 | Methods for connecting inter-layer conductors and components in 3D structures | Ryan Wicker, Eric MacDonald, Danny W. Muse, David Espalin | 2020-05-19 |
| 10518490 | Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices | Ryan Wicker, Eric MacDonald, Danny W. Muse, David Espalin | 2019-12-31 |
| 10335673 | Electronic gaming die | Danny W. Muse, Ryan Wicker, Eric MacDonald, Rodolfo Salas | 2019-07-02 |
| 9908037 | Electronic gaming die | Danny W. Muse, Ryan Wicker, Eric MacDonald, Rodolfo Salas | 2018-03-06 |
| 9414501 | Method for connecting inter-layer conductors and components in 3D structures | Ryan Wicker, Eric MacDonald, Danny W. Muse, David Espalin | 2016-08-09 |
| 8252223 | Methods and systems for integrating fluid dispensing technology with stereolithography | Ryan Wicker, Jeremy A. Palmer, Don W. Davis, Bart D. Chavez, Phillip L. Gallegos | 2012-08-28 |
| 8197743 | Hydrogel constructs using stereolithography | Ryan Wicker, Karina Arcaute, Luis Ochoa, Christopher Elkins, Brenda K. Mann | 2012-06-12 |
| 7959847 | Methods for multi-material stereolithography | Ryan Wicker, Christopher Elkins | 2011-06-14 |
| 7780897 | Hydrogel constructs using stereolithography | Ryan Wicker, Karina Arcaute, Luis Ochoa, Christopher Elkins, Brenda K. Mann | 2010-08-24 |
| 7658603 | Methods and systems for integrating fluid dispensing technology with stereolithography | Ryan Wicker, Jeremy A. Palmer, Don W. Davis, Bart D. Chavez, Phillip L. Gallegos | 2010-02-09 |
| 7556490 | Multi-material stereolithography | Ryan Wicker, Christopher Elkins | 2009-07-07 |
| 7419630 | Methods and systems for rapid prototyping of high density circuits | Jeremy A. Palmer, Donald W. Davis, Bart D. Chavez, Phillip L. Gallegos, Ryan Wicker | 2008-09-02 |