Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748867 | Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices | Ryan Wicker, Eric MacDonald, Francisco Medina, David Espalin | 2020-08-18 |
| 10660214 | Methods for connecting inter-layer conductors and components in 3D structures | Ryan Wicker, Francisco Medina, Eric MacDonald, David Espalin | 2020-05-19 |
| 10518490 | Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices | Ryan Wicker, Francisco Medina, Eric MacDonald, David Espalin | 2019-12-31 |
| 10335673 | Electronic gaming die | Ryan Wicker, Eric MacDonald, Rodolfo Salas, Francisco Medina | 2019-07-02 |
| 9908037 | Electronic gaming die | Ryan Wicker, Eric MacDonald, Rodolfo Salas, Francisco Medina | 2018-03-06 |
| 9414501 | Method for connecting inter-layer conductors and components in 3D structures | Ryan Wicker, Francisco Medina, Eric MacDonald, David Espalin | 2016-08-09 |