Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7745239 | Arrangement of fill unit elements in an integrated circuit interconnect layer | Andrew B. Kahng, Pakman Wong, Puneet Gupta | 2010-06-29 |
| 7676772 | Layout description having enhanced fill annotation | Andrew B. Kahng, Pakman Wong | 2010-03-09 |