Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10487164 | Automobile interior part with reduced squeaking noises | Masahiko Nagasaka, Masaki Maeda, Kazuya Egawa | 2019-11-26 |
| 10227486 | Contacting part made of thermoplastic resin composition with reduced squeaking noises | Kazuya Egawa | 2019-03-12 |
| 10189982 | Contacting component and structure containing said contacting component | Kazuya Egawa | 2019-01-29 |
| 9777146 | Thermoplastic resin composition and molded article | Kazuya Egawa | 2017-10-03 |
| 9777147 | Thermoplastic resin composition for reduction of squeaking noises and structure of reduced squeaking noises | Kazuya Egawa | 2017-10-03 |
| 9708482 | Contacting component and structure containing said contacting component | Kazuya Egawa | 2017-07-18 |
| 9353249 | Thermoplastic resin composition for reduction of squeaking noises and structure of reduced squeaking noises | Kazuya Egawa | 2016-05-31 |
| 9309390 | Contacting part made of thermoplastic resin composition with reduced squeaking noises | Kazuya Egawa | 2016-04-12 |
| 8238440 | Semiconductor integrated circuit | Hiroshige Abe, Mika Mizutani | 2012-08-07 |
| 7247420 | Two-layer film and method of forming pattern with the same | Masaru Ohta, Atsushi Ito, Katsumi Inomata, Shin-ichiro Iwanaga | 2007-07-24 |
| 6697906 | Semiconductor device supporting integrated data transfer bridging between CPU memory and I/O device | Kazushige Ayukawa, Jun Sato, Takashi Miyamoto, Kenichiro Omura, Hiroyuki Hamasaki +5 more | 2004-02-24 |
| 6423463 | Photosensitive resin composition, photosensitive resin film, and method of forming bumps using same | Masaru Oota, Kouichi Hirose, Yasuaki Yokoyama, Hozumi Sato | 2002-07-23 |