Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6274422 | Method for manufacturing a semiconductor device | — | 2001-08-14 |
| 5981043 | Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield | Hisatoshi Murakami, Tsunehiko Terada, Shohei Morimoto | 1999-11-09 |
| 5917751 | Nonvolatile semiconductor memory device | — | 1999-06-29 |
| 5825689 | Nonvolatile semiconductor memory device having data detecting circuit for memory cells block | — | 1998-10-20 |
| 5736070 | Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield | Hisatoshi Murakami, Tsunehiko Terada, Shohei Morimoto | 1998-04-07 |
| 5567357 | Conductive paint having good adhesion to molding of metallic oxide | — | 1996-10-22 |
| 5466893 | Printed circuit board having enhanced EMI suppression | Fumio Nakatani, Hisatoshi Murakami, Tsunehiko Terada, Shohei Morimoto | 1995-11-14 |
| 5449863 | Printed circuit board | Fumio Nakatani, Hisatoshi Murakami, Tsunehiko Terada, Shohei Morimoto | 1995-09-12 |
| 5341274 | Printed circuit board with enhanced EMI suppression | Fumio Nakatani, Hisatoshi Murakami, Tsunehiko Terada, Shohei Morimoto | 1994-08-23 |
| 4801489 | Printed circuit board capable of preventing electromagnetic interference | Katsuya Nakagawa, Kazumasa Eguchi, Fumio Nakatani, Hisatoshi Murakami, Tsunehiko Terada | 1989-01-31 |
| 4789411 | Conductive copper paste composition | Kazumasa Eguchi, Fumio Nakatani, Hisatoshi Murakami, Tsunehiko Terada | 1988-12-06 |