Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7214419 | Conductive paste multilayered board including the conductive paste and process for producing the same | Hiroaki Umeda, Kiyoshi Iwai | 2007-05-08 |
| 5981043 | Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield | Shinichi Wakita, Tsunehiko Terada, Shohei Morimoto | 1999-11-09 |
| 5779941 | 1,2-N-acyl-N-methylene-ethylenediamine, and electroconductive paste comprising it | Hiroaki Umeda, Tsunehiko Terada | 1998-07-14 |
| 5736070 | Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield | Shinichi Wakita, Tsunehiko Terada, Shohei Morimoto | 1998-04-07 |
| 5466893 | Printed circuit board having enhanced EMI suppression | Fumio Nakatani, Shinichi Wakita, Tsunehiko Terada, Shohei Morimoto | 1995-11-14 |
| 5449863 | Printed circuit board | Fumio Nakatani, Shinichi Wakita, Tsunehiko Terada, Shohei Morimoto | 1995-09-12 |
| 5341274 | Printed circuit board with enhanced EMI suppression | Fumio Nakatani, Shinichi Wakita, Tsunehiko Terada, Shohei Morimoto | 1994-08-23 |
| 4801489 | Printed circuit board capable of preventing electromagnetic interference | Katsuya Nakagawa, Kazumasa Eguchi, Fumio Nakatani, Shinichi Wakita, Tsunehiko Terada | 1989-01-31 |
| 4789411 | Conductive copper paste composition | Kazumasa Eguchi, Fumio Nakatani, Shinichi Wakita, Tsunehiko Terada | 1988-12-06 |