Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996353 | Air gap seal for interconnect air gap and method of fabricating thereof | Xusheng Wu | 2024-05-28 |
| 11855155 | Semiconductor device having contact feature and method of fabricating the same | Xusheng Wu, Chang-Miao Liu, Ying-Keung Leung, Huiling Shang | 2023-12-26 |
| 11621350 | Transistor structure and method with strain effect | Xusheng Wu | 2023-04-04 |
| 11328982 | Air gap seal for interconnect air gap and method of fabricating thereof | Xusheng Wu | 2022-05-10 |
| 11302784 | Semiconductor device having contact feature and method of fabricating the same | Xusheng Wu, Chang-Miao Liu, Ying-Keung Leung, Huiling Shang | 2022-04-12 |
| 11094821 | Transistor structure and method with strain effect | Xusheng Wu | 2021-08-17 |
| 9390971 | Self-aligned barrier and capping layers for interconnects | Roy G. Gordon, Harish B. Bhandari, Yeung AU | 2016-07-12 |
| 9112005 | Self-aligned barrier and capping layers for interconnects | Roy G. Gordon, Harish B. Bhandari, Yeung AU | 2015-08-18 |
| 8569165 | Self-aligned barrier and capping layers for interconnects | Roy G. Gordon, Harish B. Bhandari, Yeung AU | 2013-10-29 |