Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12429501 | Method for detecting contact force of probe card | Ming-Cheng Hsu, Te-Kun Lin, Yu-Hsien TSAI | 2025-09-30 |
| 12055563 | Probe card, apparatus and method for detecting contact force of probe card | Ming-Cheng Hsu, Te-Kun Lin, Yu-Hsien TSAI | 2024-08-06 |
| 9535091 | Probe head, probe card assembly using the same, and manufacturing method thereof | Ming-Cheng Hsu, Wen-Feng Liao, Yuan Huang | 2017-01-03 |
| 7429795 | Bond pad structure | Chin-Chi Shen, Ming-Jer Chiu, Chih-Chiang Chen | 2008-09-30 |
| 6732446 | Cooling device for wafer machine | Pao-Kun Liao | 2004-05-11 |