Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7781235 | Chip-probing and bumping solutions for stacked dies having through-silicon vias | Yung-Liang Kuo, Hsu Ming Cheng | 2010-08-24 |
| 7598523 | Test structures for stacking dies having through-silicon vias | Yung-Liang Kuo, Hsu Ming Cheng | 2009-10-06 |