Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424568 | Method for forming recesses in a substrate by etching dummy fins | Chih-Teng Liao, Yi-Wei Chiu, Tzu-Chan Weng | 2025-09-23 |
| 12074032 | Heat shield for chamber door and devices manufactured using same | Meng-Je Chuang, Yi-Wei Chiu, Tzu-Chan Weng | 2024-08-27 |
| 11488912 | Method for forming recesses in a substrate by etching dummy fins | Chih-Teng Liao, Yi-Wei Chiu, Tzu-Chan Weng | 2022-11-01 |
| 11031252 | Heat shield for chamber door and devices manufactured using same | Meng-Je Chuang, Yi-Wei Chiu, Tzu-Chan Weng | 2021-06-08 |
| 10861800 | Integrated circuit structure having a crown-shaped semiconductor strip and an isolation region recessed in the substrate | Chih-Teng Liao, Yi-Wei Chiu, Tzu-Chan Weng | 2020-12-08 |
| 10825739 | FinFET devices and methods of forming the same | Yi-Wei Chiu, Tzu-Chan Weng, Meng-Je Chuang | 2020-11-03 |
| 10734246 | Heat shield for chamber door and devices manufactured using same | Meng-Je Chuang, Yi-Wei Chiu, Tzu-Chan Weng | 2020-08-04 |
| 10679950 | Methods of forming recesses in substrates by etching dummy Fins | Chih-Teng Liao, Yi-Wei Chiu, Tzu-Chan Weng | 2020-06-09 |
| 10510615 | FinFET devices and methods of forming the same | Tzu-Chan Weng, Yi-Wei Chiu, Meng-Je Chuang | 2019-12-17 |
| 10297555 | Integrated circuit structure having crown-shaped semiconductor strips and recesses in the substrate from etched dummy fins | Chih-Teng Liao, Yi-Wei Chiu, Tzu-Chan Weng | 2019-05-21 |