Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7482278 | Key-hole free process for high aspect ratio gap filling with reentrant spacer | James Wu, Yu-Hua Lee, Wen-Chuan Chiang | 2009-01-27 |
| 6077738 | Inter-level dielectric planarization approach for a DRAM crown capacitor process | Yu-Hua Lee, Cheng-Ming Wu | 2000-06-20 |