Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6236114 | Bonding pad structure | Min-San Huang, Huan Sung Fu, Ling-Sung Wang, Yong Wang, Jyh-Ren Wu | 2001-05-22 |
SY
Shung-Bing Yang
Overall (All Time): #3,582,805 of 4,157,543Top 90%
1
Patents All Time