HF

Huan Sung Fu

S( Semiconductor Manufacturing International (Shanghai): 1 patents #561 of 1,122Top 50%
TSMC: 1 patents #8,466 of 12,232Top 70%
Overall (All Time): #2,114,042 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8053310 Method for defect reduction for memory cell capacitors Ling Jin, Dah Cheng Lin, Chin Hsing Yu, Meng Jan Cherng 2011-11-08
6236114 Bonding pad structure Min-San Huang, Ling-Sung Wang, Yong Wang, Jyh-Ren Wu, Shung-Bing Yang 2001-05-22