Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6951803 | Method to prevent passivation layer peeling in a solder bump formation process | Kai-Meng Tzeng, Cheng-Ming Wu, Chu-Wei Hu, Jung-Lieh Hsu | 2005-10-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6951803 | Method to prevent passivation layer peeling in a solder bump formation process | Kai-Meng Tzeng, Cheng-Ming Wu, Chu-Wei Hu, Jung-Lieh Hsu | 2005-10-04 |