Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6001681 | Method to reduce the depth of a buried contact trench by using a thin split polysilicon thickness | Hsiang-Wei Liu | 1999-12-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6001681 | Method to reduce the depth of a buried contact trench by using a thin split polysilicon thickness | Hsiang-Wei Liu | 1999-12-14 |