JH

Jing-Chuan Hsieh

TSMC: 1 patents #8,466 of 12,232Top 70%
📍 Baoshan, TW: #2,187 of 3,661 inventorsTop 60%
Overall (All Time): #3,671,228 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6001681 Method to reduce the depth of a buried contact trench by using a thin split polysilicon thickness Hsiang-Wei Liu 1999-12-14