HT

Hsien-Hua Tseng

TSMC: 1 patents #8,466 of 12,232Top 70%
📍 Pingtung City, TW: #121 of 233 inventorsTop 55%
Overall (All Time): #3,482,963 of 4,157,543Top 85%
1
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Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6755602 Wafer transport pod with linear door opening mechanism Chia-Hung Chung 2004-06-29