Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715770 | Forming semiconductor structures with semimetal features | Che-Wei Yang | 2023-08-01 |
| 11626320 | Method for manufacturing semiconductor device, method for packaging semiconductor chip, method for manufacturing shallow trench isolation (STI) | Che-Wei Yang | 2023-04-11 |
| 11605674 | Metal-insulator-semiconductor-insulator-metal (MISIM) device, method of operation, and memory device including the same | Jenn-Gwo Hwu, Chang-Feng Yan, Samuel C. Pan | 2023-03-14 |
| 11538938 | Method for forming stressor, semiconductor device having stressor, and method for forming the same | Che-Wei Yang, Samuel C. Pan | 2022-12-27 |
| 11177368 | Semiconductor arrangement | Wei-Chieh Chen, Shu-Han Chen, You-Ru Lin, Cheng-Hsien Wu, Chih-Hsin Ko +1 more | 2021-11-16 |
| 11164972 | Method for forming stressor, semiconductor device having stressor, and method for forming the same | Che-Wei Yang, Samuel C. Pan | 2021-11-02 |
| 11152251 | Method for manufacturing semiconductor device having via formed by ion beam | Che-Wei Yang | 2021-10-19 |
| 11024674 | Metal-insulator-semiconductor-insulator-metal (MISIM) device, method of operation, and memory device including the same | Jenn-Gwo Hwu, Chang-Feng Yan, Samuel C. Pan | 2021-06-01 |
| 10957602 | Method for direct forming stressor, semiconductor device having stressor, and method for forming the same | Che-Wei Yang, Samuel C. Pan | 2021-03-23 |
| 10854724 | One-dimensional nanostructure growth on graphene and devices thereof | Che-Wei Yang, Chi-Wen Liu, Ling-Yen Yeh | 2020-12-01 |
| 10832957 | Method for direct forming stressor, semiconductor device having stressor, and method for forming the same | Che-Wei Yang, Samuel C. Pan | 2020-11-10 |
| 10516050 | Method for forming stressor, semiconductor device having stressor, and method for forming the same | Che-Wei Yang, Samuel C. Pan | 2019-12-24 |
| 10515998 | Metal-insulator-semiconductor-insulator-metal (MISIM) device, method of operation, and memory device including the same | Jenn-Gwo Hwu, Chang-Feng Yan, Samuel C. Pan | 2019-12-24 |
| 10510611 | Method for direct forming stressor, semiconductor device having stressor, and method for forming the same | Che-Wei Yang, Samuel C. Pan | 2019-12-17 |
| 10504999 | Forming semiconductor structures with semimetal features | Che-Wei Yang | 2019-12-10 |
| 10347538 | Method for direct forming stressor, semiconductor device having stressor, and method for forming the same | Che-Wei Yang, Samuel C. Pan | 2019-07-09 |
| 10263097 | Method of semiconductor arrangement formation | Wei-Chieh Chen, Shu-Han Chen, You-Ru Lin, Cheng-Hsien Wu, Chih-Hsin Ko +1 more | 2019-04-16 |
| 10134865 | One-dimensional nanostructure growth on graphene and devices thereof | Che-Wei Yang, Chi-Wen Liu, Ling-Yen Yeh | 2018-11-20 |
| 9773889 | Method of semiconductor arrangement formation | Wei-Chieh Chen, Shu-Han Chen, You-Ru Lin, Cheng-Hsien Wu, Chih-Hsin Ko +1 more | 2017-09-26 |
| 9711607 | One-dimensional nanostructure growth on graphene and devices thereof | Che-Wei Yang, Chi-Wen Liu, Ling-Yen Yeh | 2017-07-18 |
| 7538406 | Ambient light sensor utilizing combination of filter layer and absoprtion layer to achieve similar sensitivity to the light as the human eye | Ta-Chun Ma, Yu-Ru Lin, Jyun-Ping Wang, Cheng-Hong Huang | 2009-05-26 |
| 6052039 | Lumped constant compensated high/low pass balanced-to-unbalanced transition | Hwann-Kaeo Chiou | 2000-04-18 |